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Copper Pyrophosphate
Molecular Formula:Cu2P2O74H2O
Molecular Weight:373.11
Standard:ACTI 2157-2002
Grade:Electroplating Use
Product Characteristics: Due to its high purity, unique crystal structure, and extremely low Fe, Ph, As contents, the product is much easier to be chelated by potassium pyrophosphate. Plating solution has excellent polarizing ability and current distribution ability. Fresh plating solution does not need to go through electrolysis procedure and can be directly used for electroplating. While electroplating, it has the following advantages: fast plating, smooth plating layer, regular, fine, tight, and no cavity crystal structure, stable plating solution, strong anti-interference ability, and simple maintenance.
[Cu(P2O7)2]6- == Cu2+ + 2P2O74-
Application: It is used to provide Cu2+ in non-cyanide electroplating.
For example: non-cyanide copper plating
Cu2P2O7 + 3K4P2O7 == 2K6[Cu(P2O7)2]
Chelating ion [Cu(P2O7)2]6- can dissociate in water solution as follows.
[Cu(P2O7)2]6-== Cu2+ + 2P2O74-
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